Si-met
Dry etching and metallization for Si-processes
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An Applied Materials P5000 dry etcher (to the left) and
a MRC sputtering tool (to the right)
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Chamber A:
etching of SiN and SiO2
Chamber B:
etching of Al, TiW, Al(Si,Cu) and TiN
Chamber C:
etching of poly-Si, poly-SiGe, and
c-Si
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Deposition of metal and metal alloys films by the sputter process.
Deposition of nitrides by reactive sputtering with N2, e.g. TiN.
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