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Dice mounting

Dice are sawn or cleaved from the substrates after completed processing. Mounting and forming of electrical contacts are made by soldering, wire bonding or flip chip bonding. 

 
 
Click on heading to sort the table.
(Extract from LIMS)
 
 NameManufacturerModel
DetailsBonderKarl SussCB8 Substrate Bonder
DetailsDisco-sawDiscoDAD3241
DetailsDisco DAD sawDiscoDAD 320
DetailsWire bonder AlbanovaKulicke - Soffa4523D
DetailsFH MS OlympusLabrum klimatLAF
DetailsFH MS NikonLabrum klimatLAF
DetailsMicro Diamond Scriber, AlbanovaOEG GmbHMR-200
DetailsESEC Automatic WirebonderESEC3100 plus
DetailsParoteq Bonder AlbanovaParoteq GmbHH-system
DetailsCentrifuge Z 323HERMLEZ 323
DetailsHB16-TPT wire bonderTPTHB16
DetailsDisco cleanerDiscoDCS1441
DetailsMTPX'DisplayMTP-1002

 

2020-06-30 Quality group (P)